Construction |
|
---|---|
Conductor | Bare copper wire, Ø 0.56 mm (AWG 23) |
Insulation | Foamskin PE, Ø 1.38 mm |
Twisting | 2 cores to the pair |
Pair Screen | Al-laminated plastic foil |
Cable lay up | 4 pairs (PiMF) to the core |
Screen | copper braid, tinned (ca. 40 % coverage) |
Sheath | LSZH or LSFRZH, orange |
Outer Diameter | Nom. 7.3mm |
Weight | Nom. 54.5 kg/km |
Mechanical properties |
||
---|---|---|
Bending radius | without load | ≥ 30 mm |
with load | ≥ 60 mm | |
Temperature range | during operation | -20°C to + 60°C |
during installation | 0°C to + 50°C |
Electrical properties at 20°C ± 5°C |
|||
---|---|---|---|
Loop resistance | ≤ 165 Ω/km | ||
Resistance unbalance | ≤ 2% | ||
Insulation resistance | (500 V) | ≥ 2000 MΩ*km | |
Mutual capacitance | at 800 Hz | Nom. 43 nF/km | |
Capacitance unbalance | (pair/ground) | ≤ 1500 pF/km | |
Characteristic impedance | (1-100 MHz) | (100 ± 5) Ω | |
(100 - 250) MHz | (100 ± 10) Ω | ||
(250 - 600) MHz | (100 ± 15) Ω | ||
Nominal velocity of propagation | ca. 79 % | ||
Propagation delay | ≤ 427 ns/100m | ||
Delay skew | ≤ 12 ns/100m | ||
Test voltage | (DC, 1 min) core/core and core/screen | 1000 V | |
Transfer impedance | At 1 MHz | ≤ 12 mΩ /m | Grade 2 |
At 10 MHz | ≤ 10 mΩ /m | Grade 2 | |
At 30 MHz | ≤ 30 mΩ /m | Grade 2 | |
Coupling attenuation | ≥ 80 dB | Type 2 | |
Segregation classification acc. EN 50174-2 | „D“ | ||
Attenuation @ 1000 Mhz | 63.1 dB | ||
NEXT @ 1000 Mhz | 80.0 dB | ||
PS-NEXT @ 1000 Mhz | 17.0 dB | ||
ACR @ 1000 Mhz | 77.0 dB | ||
PS-ACR @ 1000 Mhz | 14.0 dB | ||
PS-ACR-F @ 1000 Mhz | 54.0 dB |
Ordering Information | |||
---|---|---|---|
SAP IC | UC P/N | Product Description | P.U |
1001036 | 73075 | UC 900 HS23 Cat.7 S/FTP, Individual pair foil, 40% braid, LSZH | 500m/reel |